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PN Junction

Basic Concepts

PN Junction — A special region formed at the interface between P-type and N-type semiconductors, serving as the foundation for all semiconductor devices.

Basic Structure of a PN Junction: Depletion Layer and Built-in Electric Field P Region ⊕ ⊕ ⊕ ⊕ ⊕ ⊕ Depletion Layer Space Charge Region No free carriers N Region ⊖ ⊖ ⊖ ⊖ ⊖ ⊖

High hole concentration High electron concentration

Space Charge Region (Built-in Electric Field) Carrier diffusion causes positive and negative charges to accumulate at the interface, forming a built-in electric field; this field in turn prevents carriers from continuing to diffuse, eventually reaching a dynamic equilibrium in the PN junction.

Formation Principle

1. Carrier Diffusion

  • Holes in the P region diffuse into the N region
  • Electrons in the N region diffuse into the P region
  • They recombine and disappear upon meeting

2. Formation of the Space Charge Region

  • Accumulation of positive and negative charges → Built-in electric field
  • The electric field prevents carriers from continuing to diffuse
  • Dynamic equilibrium is reached

3. Built-in Potential

Vbi ≈ 0.7V (Silicon) / 0.3V (Germanium)

Depends on doping concentration and temperature

Bias States

Forward Bias

  P Region ─┤+├─── N Region
      ├──+
      │  ← Applied Voltage
      ├-+
      
Current Direction: P → N
CharacteristicDescription
Applied Voltage> Vbi (approx. 0.7V)
CurrentExponential growth: I = Is(e^(V/VT) - 1)
ResistanceLow

Reverse Bias

  P Region ─┤-├─── N Region
      │+|
      │  ← Applied Voltage
      │+
      ├-

Current Direction: Almost zero (except for leakage current)
CharacteristicDescription
Applied Voltage> 0V
CurrentVery small (Reverse leakage current)
ResistanceHigh

Breakdown Mechanisms

Breakdown occurs when the reverse voltage is too high:

1. Zener Breakdown

  • Vz < 5V
  • Strong electric field directly breaks covalent bonds
  • Reversible, Zener diodes utilize this principle

2. Avalanche Breakdown

  • Vz > 5V
  • Carrier acceleration causes impact ionization
  • Chain reaction
  • Reversible

Parasitic Parameters

     ┌─────────────────────┐
     │    ┌───┐            │
────┤    │ Vd│            ├────
     │    └───┘            │
     │   ┌─────────┐       │
     │   │   Cj    │ ← Junction Capacitance
     │   └─────────┘       │
     └─────────────────────┘

- Cj: Junction Capacitance (Significant under reverse bias)
- Reverse Recovery Time (Switching Characteristics)

Energy Band Diagram

Equilibrium State

Energy
  ↑
  │    P Region       N Region
  │   ════           ════    Valence Band
  │     ↑              ↑
  │   Holes          Electrons
  │     │              │
  │   ──────────────────    Fermi Level
  │     │      ↓     │
  │     │  Built-in Electric Field│
  │     │      │     │
  └─────┴──────┴─────┴──

Forward Bias

  • Potential barrier decreases
  • Carriers can diffuse across

Reverse Bias

  • Potential barrier increases
  • Depletion layer widens

Temperature Characteristics

ParameterTemperature Effect
Vd (Forward Voltage Drop)For every 1°C increase, Vd decreases by 2mV
Is (Reverse Saturation Current)For every 10°C increase, Is doubles
Breakdown VoltageGenerally, as temperature increases, Vz increases (Avalanche)

Key Formulas

Shockley Equation

I = Is × (e^(V/(n×VT)) - 1)

Is: Reverse Saturation Current
VT: Thermal Voltage = kT/q ≈ 26mV (Room Temperature)
n: Ideality Factor (1~2)

Depletion Layer Width

W = √(2εSi × Vbi / q × (1/NA + 1/ND))

NA, ND: Doping Concentrations

Keywords: PN Junction, Forward Bias, Reverse Bias, Depletion Layer, Built-in Electric Field, Breakdown, Zener, Avalanche