---
title: Protection Circuits
url: https://doc.liz6.com/en/hardware/08-power-and-protection/03-protection-circuits
locale: en
area: hardware
tags:
- hardware
- power-and-protection
date: 2026-06-30
modified: 2026-07-16
description: 'The difference between engineering and experimentation: Protection circuits keep the board alive through the first power-on'
---

# Protection Circuits

> The difference between engineering and experimentation: Protection circuits keep the board alive through the first power-on

---

## ESD Protection

### Problem
```
Human body static electricity: Up to 15kV (discharge you can't feel)
Device tolerance: MOSFET gate ~20V, CMOS IC ~2kV (HBM)

Dry winter, walking on carpet in slippers → touch the board → IC dies
Symptoms: "It worked yesterday, but not today."
```

### Protection Components

#### TVS Diode (Most Common)
```
Selection:
  Operating Voltage Vrwm > Maximum normal voltage of the protected signal
  Clamping Voltage Vcl < Maximum withstand voltage of the protected device
  Power: Based on ESD rating (IEC 61000-4-2)

Layout Golden Rule:
  TVS must be placed next to the connector, not next to the IC!
```

<svg viewBox="0 0 720 300" xmlns="http://www.w3.org/2000/svg" font-family="-apple-system,'Source Han Sans CN','Microsoft YaHei',sans-serif" role="img" aria-label="TVS diode layout comparison: Correct is near connector, Incorrect is near IC">
  <defs>
    <marker id="tvs-arrow" markerWidth="10" markerHeight="8" refX="8" refY="3" orient="auto"><path d="M0,0 L8,3 L0,6 Z" fill="#475569"/></marker>
  </defs>
  <rect width="720" height="300" fill="#ffffff"/>
  <text x="360" y="28" text-anchor="middle" font-size="17" font-weight="700" fill="#1f2933">TVS Layout Golden Rule: Must be close to the connector, not the IC</text>

  <text x="40" y="60" font-size="13" font-weight="700" fill="#166534">✓ Correct</text>
  <rect x="60" y="68" width="110" height="48" rx="6" fill="#e2e8f0" stroke="#cbd5e1"/>
  <text x="115" y="97" text-anchor="middle" font-size="13" font-weight="700" fill="#334155">Connector</text>
  <line x1="170" y1="92" x2="208" y2="92" stroke="#475569" stroke-width="1.6" marker-end="url(#tvs-arrow)"/>
  <rect x="210" y="77" width="70" height="30" rx="6" fill="#22c55e"/>
  <text x="245" y="97" text-anchor="middle" font-size="12" font-weight="700" fill="#ffffff">TVS</text>
  <line x1="282" y1="92" x2="430" y2="92" stroke="#475569" stroke-width="1.6" marker-end="url(#tvs-arrow)"/>
  <rect x="432" y="68" width="110" height="48" rx="6" fill="#e2e8f0" stroke="#cbd5e1"/>
  <text x="487" y="97" text-anchor="middle" font-size="13" font-weight="700" fill="#334155">IC</text>
  <text x="548" y="97" font-size="11.5" fill="#166534">✓ TVS intercepts first, IC is safe</text>

  <text x="40" y="150" font-size="13" font-weight="700" fill="#dc2626">✗ Incorrect</text>
  <rect x="60" y="158" width="110" height="48" rx="6" fill="#e2e8f0" stroke="#cbd5e1"/>
  <text x="115" y="187" text-anchor="middle" font-size="13" font-weight="700" fill="#334155">Connector</text>
  <line x1="170" y1="182" x2="340" y2="182" stroke="#475569" stroke-width="1.6" marker-end="url(#tvs-arrow)"/>
  <rect x="342" y="167" width="70" height="30" rx="6" fill="#ef4444"/>
  <text x="377" y="187" text-anchor="middle" font-size="12" font-weight="700" fill="#ffffff">TVS</text>
  <line x1="414" y1="182" x2="430" y2="182" stroke="#475569" stroke-width="1.6" marker-end="url(#tvs-arrow)"/>
  <rect x="432" y="158" width="110" height="48" rx="6" fill="#e2e8f0" stroke="#cbd5e1"/>
  <text x="487" y="187" text-anchor="middle" font-size="13" font-weight="700" fill="#334155">IC</text>
  <text x="548" y="187" font-size="11.5" fill="#dc2626">✗ ESD has already hit the IC</text>

  <rect x="40" y="222" width="640" height="60" rx="8" fill="#dcfce7" stroke="#4ade80"/>
  <text x="56" y="246" font-size="12.5" fill="#166534">Key Principle: The TVS must be the first component in the ESD discharge path—the closer to the connector, the more timely the clamping.</text>
  <text x="56" y="266" font-size="12.5" fill="#166534">Trace Order: Connector → TVS (as close as possible) → Series Resistor/Ferrite Bead → IC. Keep the TVS to GND loop as short as possible.</text>
</svg>

```text
  Trace: Connector → TVS (as close as possible) → Series Resistor/Ferrite Bead → IC
  Keep the TVS to GND loop as short as possible
```

#### USB Signal Line ESD Protection
```
USB 2.0 (D+/D-): Use dedicated USB ESD chips
  Example: USBLC6-2, SRV05-4
  Capacitance < 2.5pF (otherwise it affects high-speed signals)

USB 3.x (SuperSpeed): Must use ultra-low capacitance TVS
  Example: TPD4E05U06 (< 0.5pF)

VBUS: Use 5V~24V TVS (depending on PD voltage)
```

#### GPIO / Low-Speed Signals
```
Simple Solution: Series Resistor + Shunt TVS
  GPIO ── 100Ω ──┬──  TVS → GND
                  └──  To External

Resistor limits ESD current, TVS clamps voltage
100Ω ~ 1kΩ, depending on signal speed
```

---

## Reverse Polarity Protection

### Problem
```
DC barrel jack / terminal block → Polarity reversed → Board burns out
Especially: Late at night, under deadline, when wiring for others
```

### Solution 1: Series Diode (Simplest)
```
Vin ──▸├── System
         │
      (Voltage Drop Vf)

Pros: Simplest
Cons: Voltage drop 0.3~0.7V, severe heating at high currents
      P_loss = Vf × I → 3A×0.7V=2.1W pure waste

Applicable: <1A low current / voltage drop insensitive
```

### Solution 2: PMOS Reverse Polarity Protection ★ Recommended
```
         S   D
Vin ────┬── P-MOSFET ──── System
        │   G
        │   │
        └───┤├── GND
            Rgs (10k~100k)

Normal: Vin+ connected to S, G pulled to GND via R
      → Vgs = -Vin → PMOS turns on → Almost no voltage drop

Reverse: G pulled to Vin+ via R → Vgs ≈ 0 → PMOS turns off
      → Body diode reverse biased → System has no power

Voltage Drop = I × Rds(on) → Typically < 0.1V @ 3A (Rds(on)=30mΩ)
Loss = I² × Rds(on) = 0.27W @ 3A (vs 2.1W for diode!)

Select MOSFET: Lower Rds(on) is better, Vgs(th) must be lower than Vin
       Vds > Vin (with margin)
```

### Solution 3: Bridge Rectifier (Fully Automatic)
```
Works regardless of polarity, but voltage drop is 2×Vf (two diodes in series)
Applicable: Cost-insensitive, low current
```

---

## Fuse Selection

### Types

| Type | Blow Speed | Typical Application |
|------|------------|---------------------|
| Fast-acting (Fast) | ms level | Semiconductor protection |
| Slow-acting (Slow/T) | Hundreds of ms to s | Motors/Transformers/Capacitive loads |
| Resettable (PTC) | Does not blow, limits current | USB output/Battery packs |
| SMD Fuse | ms level | Low current on PCB |

### Selection Parameters
```
Rated Current In: Normal operating current × 1.25 (with margin)
        Example: Operating at 2A → Select 2.5A

Rated Voltage: Must be ≥ Maximum circuit voltage
Breaking Capacity: Maximum current the fuse can interrupt during a fault
        Battery powered: At least 50A (short-circuit current is huge!)

I²t: Energy integral, energy required to blow
    When selecting a fuse, ensure I²t(fuse) < I²t(MOSFET withstand)
    Otherwise, the MOSFET burns out before the fuse blows
```

### Resettable Fuse (PTC)
```
Principle: Overcurrent → Heating → Resistance increases sharply → Current limiting
Reset: Automatically recovers after power-off and cooling

Pros: Reusable, no need to replace
Cons: Slow action (ms~s), high leakage current, resistance sensitive to temperature

Typical Applications: USB port protection (500mA/1A/2A ratings)
        Battery pack output
Not suitable for: Precision circuits requiring fast cutoff
```

---

## Inrush Current Suppression

### Power-on Inrush
```
Capacitive load at power-on:
  Capacitor initial voltage 0V → Equivalent short circuit → Current spike

       ┌── R ──┬──
  Vin ─┘       ┌┴┐
               │C│ (Large Capacitor)
               └┬┘
                │
               GND

I_peak = Vin / (R_trace + ESR)
Can be several times the normal current → Blows fuse / triggers overcurrent protection
```

### Solutions
```
1. NTC Thermistor (Simplest):
   High resistance when cold → Limits current → Self-heating → Resistance drops → Normal conduction
   Cons: Residual resistance remains when hot, ineffective with frequent switching (hasn't cooled down)

2. Soft Start (Active):
   MOSFET gate charged slowly → Gradual turn-on → Limits current slew rate
   Requires additional RC + MOSFET

3. Current Limiting IC:
   Dedicated Hot Swap Controller
   e.g., TPS2490, LM5069
   Used in servers/telecom cards (hot-swappable)
```

---

## Overvoltage Protection

```
TVS clamping is transient (μs level)
Sustained overvoltage requires different solutions:

1. Zener + Fuse (Crowbar):
   Vin ── Fuse ──┬── System
                 ├── Zener → GND
   Vin > Vz → Zener conducts → High current → Fuse blows
   Simple and crude, but requires replacing the fuse

2. OVP IC:
   Detects voltage > Threshold → Cuts off MOSFET
   e.g., NCP346, AP9101C
   Recoverable, no need to replace fuse

3. OVP at LDO Input:
   Many LDOs have built-in input overvoltage protection
   Automatically shuts down when out of range
```

---

## Practical Checklist

```
□ Every external connector has ESD protection (TVS close to connector)
□ DC power input has reverse polarity protection (PMOS or diode)
□ Every power rail has an appropriate fuse
□ VBUS/USB power has PTC resettable fuse
□ Large capacitor input has inrush suppression strategy
□ Power loop area is small (reduces spikes caused by parasitic inductance)
□ Inductive loads like relays/motors have flyback diodes
□ MOSFET gates have protection (TVS or Zener + series resistor)
```

---
*Keywords: ESD, TVS, Reverse Polarity Protection, PMOS, Fuse, PTC, Inrush, Soft Start, Overvoltage Protection, Flyback Diode*
